Comparison ledger
Applied Materials SEMVision G 3, KLA 0035235-003 MMD Head, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SEMVision G 3Applied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Wafer Handling | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials SEMVision | KLA 0035235-003 MMD Head |
| Specifications | ||
| Wafer size | Wafer Handling[1] | — |
| Loader | AMAT ADO with RFID / OCLP / SMIF[1] | — |
| Configuration | Configuration:[1] | TSTD PCB ASSY, MMD MEAS HEAD[3] |
| Pal (On the OTW, cassette / Slot 1 | Delta X= 500 μms; Delta Y= 500 μm[1] | — |
| ITU Repeatability | Delta X and Delta Y < 20 μm[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Model | SEMVision G 3[1] | 0035235-003[3] |
| Category | Metrology & Inspection[2] | — |
| Wafer handling | 8-inch and 12-inch wafer handling capability[2] | — |
| System performance | ITU Repeatability: Delta X and Delta Y < 20 μm; Stage accuracy: Delta X and Delta Y < 1.5 μm; MTR: Delta X = 50 μms; Delta Y = 30 μms[1] | — |
| Resolution at 1 KeV | 3 nm[1] | — |
| EDX resolution | 4 nm[1] | — |
| Wafer throughput | 15 wafers / hour[1] | — |
| Defects throughput | >1800 defects / hour[1] | — |
| Cleanliness front side | 0.013 PWP / cm2 > size at 0.2 μm[1] | — |
| Make | — | KLA[3] |
| Part Description | — | TSTD PCB ASSY, MMD MEAS HEAD[3] |
| Compatible System | — | KLA AIT-XP[3] |
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