Waferpedia

Comparison ledger

Producer SEversusS 1861 14

Applied Materials Producer SE, Orient Service S 1861 14, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Deposition, null[1]
Side-by-side comparison of selected equipment models
Attribute
Producer SEApplied Materials
S 1861 14Orient Service
OEMApplied MaterialsOrient Service
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2006 Vintage · 2008 Vintage—
Control system——
Generation——
FamilyApplied Materials ProducerOrient Service S 1861 14
Specifications
ConfigurationChambers:[2]Used with SiO2,HCL,HF,NOx,NH3,etc[1]
Phase3 Phase[5]—
Wafer Size12 inch (300mm)[2]—
Process TypePECVD (Plasma-Enhanced Chemical Vapor Deposition)[2]—
Chamber Configuration (PECVD)A: PECVD APE, B: PECVD TEOS, C: PECVD BLOK[2]—
Chamber Configuration (CVD)ACL (2CH) – two chambers[3]—
Electrical Requirements3 Phase, 4 Wire, 50/60 Hz[5]—
Vintage Year2006[3]—
Process typeCVD[3]—
Process type variantPECVD[2]—
Chamber configurationChamber A: PECVD APE; Chamber B: PECVD TEOS; Chamber C: PECVD BLOK[2]—
Vintage2006, 2007, 2008[3]—
Chamber types (PECVD)APE, TEOS, BLOK[2]—
Manufacturing vintage2006/2007[3]—
Electrical3 phase, 4 wire, 50/60 Hz[5]—
OEMApplied Materials[2]—
ModelProducer SE[2]—
Wafer size12 inch[6]—
Technology—PECVD (Plasma-Enhanced Chemical Vapor Deposition)[1]
Process chemistry—SiO2, HCl, HF, NOx, NH3, etc.[1]
Vintage year—2015[1]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]Equipment inventory listing
  7. [7]inventory listing
  8. [8]inventory listing