Comparison ledger
Applied Materials 0720 06060 Part, Semics Opus 3 SD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | Opus 3 SDSemics |
|---|---|---|
| OEM | Applied Materials | Semics |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Semics Opus |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | 200 - 240V[2] |
| Ambient & Hot Temperature Capability | — | Up to 150°C[3] |
| HTF Chuck Temperature Control | — | Up to 125°C[3] |
| HTF Chuck Force | — | 300 kg[3] |
| Power | — | 200 - 240V[3] |
| Current | — | 15A[3] |
| Frequency | — | 50/60Hz[3] |
| Accuracy | — | 1 µm[4] |
| Chuck size | — | 180 x 175 mm[4] |
| Operating temperature | — | -40 to 200 Degree C[4] |
| Overall dimensions | — | 1530 x 1782 x 960 mm[4] |
| Probing force | — | 450 kgf[4] |
| Type | — | Automatic[4] |
| Wafer size | — | 6 Inches, 8 Inches, 12 Inches[4] |
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