Comparison ledger
Applied Materials 0242-36515 RTP XE Chamber Temperature Match Kit, Thermco 5200 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0242-36515 RTP XE Chamber Temperature Match KitApplied Materials | 5200 DiffusionThermco |
|---|---|---|
| OEM | Applied Materials | Thermco |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Thermco 5200 Diffusion |
| Specifications | ||
| Configuration | — | Boron[1] |
| Make | — | Thermco[2] |
| Model | — | 5200[2] |
| Wafer size | — | 6 inch[2] |
| Process chambers | — | Two to four-process chamber systems[3] |
| Substrate diameter | — | Up to 150 mm[3] |
| Applications | — | Semiconductor, PV, LED, Nano, and MEMS substrates[3] |
| Control system | — | Thermco TMX controller[3] |
| Heating zones | — | 3 independently controlled heating zones[3] |
| Operating temperature range | — | 200°C to 1350°C[3] |
| Flatzone | — | 1,100 mm[3] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →