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Comparison ledger

0041-26723 Bonded Assemblyversus7476 E 79 Wedge

Applied Materials 0041-26723 Bonded Assembly, West Bond 7476 E 79 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 7476
Specifications
Configuration—Deep Access[1]
Memory—Battery Back -Up Ram[1]
Data Entry—Selector Switch[1]
Z Tool Range—0.5625 Inch[1]
Z Encoder Resolution—0.002 Inch[1]
Bond Force Range—Adjustable, 10 To 250 Grams[1]
ESD Protection—Protection Against Electrostatic Discharge[1]
Display—4 Line, 40 Character LCD[1]
Conventional Tool Length—0.750 Inch (7400e)[1]
Micromanipulator—Dual Counterbalanced, Single Lever, 8:1 Ratio[1]
Wire Spool Mount—0.5 Inch With Ball Bearing Rollers[1]
Voltage—110v, 50/60hz, 2a[1]
Make—WestBond[1]
Model—7476 E 79[1]
Category—Packaging & Bonding[2]
Tool type—wedge wire bonder[1]
Access—Deep Access[1]
Power—110v, 50/60hz, 2a[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com