Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus7374E

Applied Materials 0041-26723 Bonded Assembly, West Bond 7374E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
7374EWest Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 7374E
Specifications
Series—7372E / 7367E / 7374E Series[1]
Type—Manual Die Bonder[1]
Configuration—Dual-head[1]
Construction—Gantry construction[1]
Motion—Orthogonal motions rather than pivoted[1]
Axis brakes—Individual axis brakes; X, Y, and Z axes can be braked pneumatically on signal[1]
Protection—ESD protection included[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]cltrep.comcltrep.com