Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus7372E

Applied Materials 0041-26723 Bonded Assembly, West Bond 7372E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
7372EWest Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 7372E
Specifications
Series—E-Series[1]
Machine type—Dual-head die bonder[1]
Construction—Gantry construction[1]
Motion—Orthogonal motions rather than pivoted[1]
Axis brakes—Individual axis brakes[1]
Protection—ESD protection included[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]cltrep.comcltrep.com