Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec SB 6 GEN 2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | SB 6 GEN 2SUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec SB 6 GEN 2 |
| Specifications | ||
| Tool type | — | Substrate bonder[1] |
| Maximum wafer diameter | — | 150 mm[1] |
| Substrate sizes | — | Pieces to 150 mm[1] |
| Minimum chamber vacuum | — | 5 × 10-5 bar[1] |
| Maximum temperature | — | 550 °C[1] |
| Maximum bonding force | — | 20 kN[1] |
| Power supply for anodic bonding | — | 2000 V, 60 mA[1] |
| Maximum thickness | — | 9.99 mm[1] |
| Automation | — | Semi-automated[2] |
| Applications | — | MEMS, LED, packaging, 2.5D/3D integration[2] |
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