Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, MRSI HVM3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | HVM3MRSI |
|---|---|---|
| OEM | Applied Materials | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2018– |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2019 Name change |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | MRSI HVM3 |
| Cited variants | — | |
| Specifications | ||
| Application | — | Microwave modules, hybrid, optical modules, epoxy and eutectic die bonding[3] |
| Placement accuracy | — | 3 microns, 3 sigma, true radial placement (depending on application)[3] |
| Placement repeatability | — | ≤ 1 micron[3] |
| XY motors | — | Brushless DC linear motors with glass-scale encoder resolution of 50 nm[3] |
| X travel | — | 17.5 in (444.5 mm)[3] |
| Y travel | — | 36.0 in (914.4 mm)[3] |
| Z travel | — | 1.5 in (38.1 mm)[3] |
| Theta travel | — | 360°[3] |
| Theta resolution | — | 0.0045°[3] |
| Pressure control | — | 10 g to 5 kg per placement[3] |
| Cameras | — | 2 down-looking cameras sharing an optical path; 1 up-looking camera[3] |
| Vision system | — | Edge detection and pattern recognition[3] |
| Lighting | — | Red, green, and blue; ring or coaxial illumination; programmable intensity[3] |
| Pickup nozzles | — | 13 in standard nozzle changer; multiple changers optional; can also carry epoxy dispensing heads[3] |
| Waffle packs | — | Up to 72 2 x 2 in waffle packs (50.8 x 50.8 mm) or Gel-Paks™ or 4 x 4 in (101.6 x 101.6 mm)[3] |
| Tape and reel feeders | — | Up to ten 8 mm tape and reel feeders[3] |
| Eutectic bonding | — | Programmable ramp rate; maximum temperature 450°C[3] |
| Process gases | — | Nitrogen, argon, N2-H2, or Ar-H2[3] |
| Dispense pumps | — | 2 syringe rotary screw pumps or time/pressure-controlled pumps[3] |
| Dispense height sensing | — | 3-point laser height mapping of the substrate plane[3] |
| Dispense needle cleaning | — | Automated programmable cleaning between pattern dispense intervals[3] |
| Dispense needle calibration | — | Automatic software calibration using beam sensor[3] |
| Repeatability | — | ≤ 1 µm[3] |
| Minimum chip size | — | 0.008 sq. inch (200 sq. micron)[3] |
| Illumination | — | RGB; ring or coaxial; intensity programmable[3] |
| Eutectic temperature | — | up to 450ºC[3] |
| Minimum placement force (closed loop) | — | 10 g[3] |
| Maximum placement force (closed loop) | — | 5 kg[3] |
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