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Comparison ledger

0041-26723 Bonded Assemblyversus3600 Plus

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa 3600 Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3600 PlusKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa 3600 Plus
Specifications
Model—3600 Plus[1]
Asset #—74055[1]
Description—Wire Bonder[1]
Category—Packaging & Bonding[2]
Wire diameter range—125 to 625 microns[4]
Z travel—50 mm[3]
Theta travel—+/- 220°[3]
Focus—30 mm (Programmable Range)[3]
Monitor—Flat Panel, 17"[3]
Transducer—60/80 kHz[3]
Forcer—50 - 1500 gr[3]
Wire range—100 to 500 μm[3]
Maximum wire looping—40.0 mm[3]
Die rotation—+/- 70°[3]
Pattern recognition type—Enhanced OE GS III[3]
Connectivity—Ethernet, USB[3]
Storage—Hard Disk Drive (HDD)[3]
Footprint—680 mm x 1308 mm[3]
Certification—CE Certification[3]
Operating system—VX Works and Windows XP[3]
Power consumption—5 A at 230 V[3]
Power requirement—180-240 VAC, Single Phase, 50/60 Hz[3]
Bond area X—250 mm[3]
Bond area Y—150 mm[3]
Manufacturer—Kulicke & Soffa (K&S)[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]wotol.comwotol.com
  4. [4]antycip.comantycip.com