Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 850 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 850 WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 850 |
| Specifications | ||
| Configuration | — | 50/60 Hz[1] |
| Power Consumption | — | 28,9 kW[1] |
| Full Load Current Rating | — | 89,1 A[1] |
| Largest Current Rating | — | 28,9 A[1] |
| Power | — | 5.5 kW[2] |
| Voltage | — | 120/208 V, 3 Phase[2] |
| Manufacturer | — | EVG[1] |
| Model | — | 850 Wafer[1] |
| Category | — | Packaging & Bonding[1] |
| Wafer sizes | — | 2, 3, 4, 5, 6, 8, 12 inch[1] |
| Wafer size limit | — | up to 8 inch[1] |
| Frequency | — | 50/60 Hz[1] |
| Vintage | — | 2001[2] |
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