Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 850 Debonder, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 850 DebonderEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 850 |
| Specifications | ||
| Phase | — | 3 Phase[1] |
| Configuration | — | 50/60 Hz[1] |
| Manufacturer | — | EV Group[2] |
| Model | — | 850 Debonder[3] |
| Model designation | — | EVG®850 DB Automated Debonding System[2] |
| Function | — | Fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks[2] |
| Wafer diameter | — | Up to 300 mm[2] |
| Wafer size | — | 2, 3, 4, 5, 6, 8, 12 inch[3] |
| Electrical | — | 3 Phase[1] |
| Electrical frequency | — | 50/60 Hz[1] |
| Feature | — | Reliable handling of thinned, bowed and warped wafers with and without topography[2] |
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