Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 510 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 510 WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 510 |
| Specifications | ||
| Configuration | — | Refurbished[1] |
| Wafer size | — | Manual wafer load substrate bonder[1] |
| Max Bond Force | — | 10 kN[1] |
| Top side heater | — | 550°C max. in 1°C steps[1] |
| Bottom side heater | — | 550°C max. in 1°C steps[1] |
| Temperature uniformity | — | ± 1,5 % Turbo pump and controller[1] |
| Manufacturer | — | EV Group[1] |
| Model | — | 510 Wafer[1] |
| Category | — | Packaging & Bonding[2] |
| Wafer handling | — | Manual wafer load substrate bonder[2] |
| Bonding capability | — | Fusion and thermal compression bonding[1] |
| Bond chamber | — | High-vacuum capable bond chamber[2] |
| Control software | — | Windows based control software and operation interface[1] |
| Turbo pump and controller | — | Included[1] |
| Roughing pump | — | Included[1] |
| System chiller | — | Included[1] |
| Load/unload tool | — | Included[1] |
| System computer, monitor, and keyboard | — | Included[1] |
| Vacuum | — | Standard: 0.1 mbar; optional: 1E-5 mbar[3] |
| Max temperature | — | 550 °C[3] |
| Loading chamber | — | Manual[3] |
| Max contact force | — | 10, 20, 60 kN[3] |
| Heater size | — | 150 mm, 200 mm[3] |
| Single chips processing | — | Yes[3] |
| Active water cooling | — | For bottom side[3] |
| Power supply for anodic bonding | — | Max voltage 2 kV; max current 50 mA[3] |
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