Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2100 FC hS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2100 FC hSBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2100 FC hS |
| Specifications | ||
| Configuration | — | Flip chip capability[1] |
| Bonding method | — | Flip Chip Bonding[2] |
| Bonding accuracy | — | 8 µm @3s (High Accuracy Mode)[2] |
| Min. cycle time | — | 240 ms (incl. dip fluxing)[2] |
| Wafer size | — | 4" to 12"[2] |
| Frame size | — | 6", 8” and 12"[2] |
| Die size | — | 0.2 to 20 mm[2] |
| Die thickness | — | ≥ 0.05 mm / ≥ 2 mils[2] |
| Strip dimensions | — | Length up to 500 mm; Width up to 125 mm (flat boats up to 137 mm)[2] |
| Machine dimensions | — | 1430 x 1440 x 1400 mm (W x D x H)[2] |
| Weight | — | Approx. 1,400 kg / 3,000 lb[2] |
| Bond force | — | 0.2 N[3] |
| Type | — | Automatic Wafer Die Attach[3] |
| Placement speed | — | Up to 16000 UPH[3] |
| Placement speed without dipping | — | Up to 12000 UPH[3] |
| X Y placement accuracy | — | 8 µm[3] |
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