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Comparison ledger

0041-26723 Bonded AssemblyversusEagle XP 5

Applied Materials 0041-26723 Bonded Assembly, ASM Eagle XP 5, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM Eagle
Specifications
Configuration—PE-ALD System Mainframe[1]
Phase—3 Phase[2]
Full Load Amps—130 A[2]
Make—ASM[1]
Model—Eagle XP 5[1]
Description—Bonder[1]
Power—AC190-220V[2]
Frequency—50/60Hz[2]
Current—25 KA[1]
Control & software—with PC & software[1]
Software Version—Eagle I ASMJ software (Windows embedded XP / OS)[3]
Failure mode—Faulty throttle valve in 2nd chamber[1]
Vintage—2010[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com