Comparison ledger
Applied Materials 0020 54137 Part, Samsung CP 45 FV, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 54137 PartApplied Materials | CP 45 FVSamsung |
|---|---|---|
| OEM | Applied Materials | Samsung |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 54137 Part | Samsung CP 45 FV |
| Cited variants | — | |
| Specifications | ||
| Configuration | Conn Ector Copper Threaded W / Solder Ptg[3] | — |
| Mounting Speed | — | 20,200 cph (high speed mounting)[4] |
| Mounting Speed (Chip top speed) | — | 0.178 sec / chip[2] |
| Mounting Speed (IPC9580) | — | 14900 CPH (1608)[2] |
| Visual Method | — | Fly Vision + Stage Vision[2] |
| Mounting Accuracy (0603 Chip) | — | ± 0.08 mm[2] |
| Mounting Accuracy (1005 Chip) | — | ± 0.1 mm[2] |
| Mounting Accuracy (QFP) | — | ± 0.04 mm[2] |
| Component Dimensions (Flight Camera) | — | 1005 (0402) ~ □ 22mm IC, 0603 (0201) ~ □ 12mm (Option)[2] |
| Component Dimensions (Standard Fixed Camera) | — | □ 32mm IC (Lead Pitch: 0.4mm)[2] |
| Lead Pitch (QFP) | — | 0.3mm (with FOV20 Vision)[2] |
| Min. Ball Pitch (BGA) | — | 0.5mm (with FOV20 Vision)[2] |
| Parts up to | — | 15mm (9mm: with flying vision)[2] |
| PCB board size (standard) | — | 460 X 400 X 4.2 mm[2] |
| Machine type | — | Pick and place[5] |
| Vision method | — | Fly Vision + Stage Vision[2] |
| Mounting speed | — | 14900CPH[2] |
| Mounting accuracy | — | 0603 (0201) Chip ± 0.08mm[2] |
| PCB board size | — | 460X400X4.2[2] |
| Component range | — | 0201 to large QFPs; BGAs to fine pitch CSPs[4] |
| Control system | — | WinXP system[2] |
| File compatibility | — | Compatible with Gerb files[2] |
| Programming | — | Off-line programming[2] |
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