Comparison ledger
Applied Materials 0020 23839 Part, Perkin Elmer 2400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 23839 PartApplied Materials | 2400Perkin Elmer |
|---|---|---|
| OEM | Applied Materials | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 23839 Part | Perkin Elmer 2400 |
| Specifications | ||
| Configuration | Plate, Sensor Clamp, Hdpcvd Ultima +[1] | Cryopump included[2] |
| Type | — | Sputtering tool[2] |
| Cathodes | — | 2 round cathodes[3] |
| MFC | — | 1 MFC[3] |
| Vacuum level | — | 2-10 millitorr[3] |
| Control system | — | New programmable HMI / PLC system[3] |
| Cryopump | — | Rebuilt CTI 8 cryopump with compressor and lines[3] |
| Mechanical pump | — | Rebuilt dual stage mechanical pump[3] |
| Electronics | — | New electronics[3] |
| Cryopump included | — | Cryopump included[2] |
| Dry pump | — | No dry pump[2] |
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