Comparison ledger
Applied Materials 0020 18455 Part, Denton Vacuum Desk II Gold, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 18455 PartApplied Materials | Desk II GoldDenton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 18455 Part | Denton Vacuum Desk |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Shaft,Rf In Local Match, Hdpcvd,Rev3[2] | leaking vacuum oil[3] |
| Input Voltage | — | 120 VAC[4] |
| Input Current | — | 10 A[4] |
| Process Gas | — | Argon (UHP-Plus grade; 99.9993% pure)[4] |
| Argon Line Pressure | — | 7 psig at tank[4] |
| Chamber Pressure (Sputter Deposition) | — | ~50 mTorr[4] |
| Sputter Current | — | ~40 mA[4] |
| Gold Deposition Rate | — | ~20 nm per 60 seconds[4] |
| Chamber Pressure (Etching) | — | ~300 mTorr[4] |
| Pumping Type | — | Turbo-pumped (in TSC variant)[1] |
| Specimen Holder | — | Rotating/tilting[1] |
| Film Thickness Monitor | — | Included (in TSC variant)[1] |
| Target Material | — | Gold/palladium (standard), with spare gold and platinum[1] |
| Particle Sizing Range | — | 1 nm to 5 microns[1] |
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