Waferpedia

Comparison ledger

0020 18455 PartversusEndura 5500

Applied Materials 0020 18455 Part, Applied Materials Endura 5500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
Endura 5500Applied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run—1990–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartApplied Materials Endura 5500
Cited variants—
  • Liner/Barrier[1]
  • Front-End Metallization[2]
  • Aluminum Interconnect[3]
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[4]Main AC Power Intel Hole[5]
Line Frequency—50 Hz[5]
Wafer Shape—SNNF[5]
Position 1—Dura TTN[5]
Position 1 Process—Durasource TTN[5]
Position 2—Aluminum[5]
Position 2 Process—Durasource AL[5]
Position 3—Dura TTN[5]
Position 3 Process—Durasource TTN[5]
Position 4—Aluminum[5]
Position 4 Process—Durasource AL[5]
Position A—Pass Thru[5]
Software—v8.89[10]
Robot—HP with Fabworx Blade, Wrist, and Arms[10]
Ch1/ch3—AICu[10]
Pedestal—A101[10]
ChE/ChF—Orient Degas[10]
Ch1—Ti[11]
Ch3—AICu[11]
Ch2/Ch4—TiN[11]
ChC/ChD—RF PCII[11]
Ch2/Ch3—AICuW[12]
Ch4—TiN[12]
ChC—RF PCII[12]
ChE—Orient Degas[12]
Ch2—AICuW[13]
Voltage—430 VAC[16]
Phase—3 Phase[18]
Frequency—60 Hz[19]
4 PVD Chambers—2TiN/1Ti/1Al[20]
2 CVD / 3 PVD Chambers—2TxZ/1Ti/1IMP Ti/1Co[1]
5 PVD Chambers—2TiN/1Ti/1Al/1NiPt[22]
Wafer Size—8 inch (200 mm)[5]
Electrical Configuration—3 Phase, 3 Wire + Ground, 480 Vac[22]
Chamber Configuration (example 1)—5 PVD Chambers: 2 TiN, 1 Ti, 1 Al, 1 NiPt[22]
Chamber Configuration (example 2)—2 CVD / 3 PVD Chambers: 2 TxZ, 1 Ti, 1 IMP Ti, 1 Co[1]
Transfer Chamber Positions (example)—Position 1: Durasource TTN, Position 2: Durasource AL, Position 3: Durasource TTN, Position 4: Durasource AL[5]
Buffer Chamber Positions (example)—Position A: Pass Thru, Position B: Cooldown, Position C: Durasource TI, Position F: Orienter (Standard Degas)[5]
System Safety Features—EMO (Turn to Release), GFI on Primary with EMO Shunt Trip, GFI on Secondary, Circuit Breaker 400 A, GFI Trip 50-100 mA, Water Leak Detector, Smoke Detector[5]
Position B—Cooldown[5]
Position C—Titanium[5]
Position C Process—Durasource TI[5]
Position F—Orienter[5]
Position F orient Type—Standard Degas with Temp feedback (Gimball Type)[5]
System EMO Type—Turn to Release[5]
Primary Side Trip Amperage—3 P 3 L 208 VAC[5]
Circuit Breaker on Secondary—400 A[5]
GFI Trip Amperage—50 ~ 100 mA[5]
Wafer Sizes—8 inch[5]
Vintage—2000[22]
Chamber Configuration (Transfer Chamber)—Position 1: Dura TTN, Position 2: Aluminum, Position 3: Dura TTN, Position 4: Aluminum[5]
Buffer Chamber Positions—Pass Thru, Cooldown, Titanium, Orienter (Standard Degas with Temp feedback)[5]
Chamber Configuration—2 CVD / 3 PVD Chambers: 2TxZ/1Ti/1IMP Ti/1Co[1]
Robot Type—VHP[3]
Application—Liner/Barrier[1]
Electrical—3 Phase - 3 Wire + Ground - 60 Hz - 480 Vac[22]
PVD Chamber Count—5[3]
PVD Chamber Types—2TiN/1Ti/1Al/1NiPt[3]

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Sources (22)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing
  9. [9]inventory listing
  10. [10]inventory listing
  11. [11]inventory listing
  12. [12]inventory listing
  13. [13]inventory listing
  14. [14]inventory listing
  15. [15]inventory listing
  16. [16]inventory listing
  17. [17]inventory listing
  18. [18]inventory listing
  19. [19]inventory listing
  20. [20]inventory listing
  21. [21]inventory listing
  22. [22]inventory listing