Waferpedia

Comparison ledger

0020 17485 PartversusCentura Ultima TE HDP

Applied Materials 0020 17485 Part, Applied Materials Centura Ultima TE HDP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
Centura Ultima TE HDPApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size—(1) Wafer Orienter Chamber
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartApplied Materials Centura Ultima TE HDP
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]—
Voltage—208 Vac[2]
Phase—3 Phase[2]
Frequency—60 Hz[2]
Wafer size—(1) Wafer Orienter Chamber[2]
Manufacturer—Applied Materials[2]
Model—Centura Ultima TE HDP[2]
Process—HDP CVD (Chemical Vapor Deposition)[2]
Chamber configuration—1 Ultima TE Chamber, 2 DxZ Nitride Chambers, 1 Wafer Orienter Chamber, 1 Multi-Slot Cooldown Chamber[2]
Electrical requirements—208 Vac, 3 Phase, 4 Wires, 60 Hz[2]
Vintage—2004[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing