Comparison ledger
Applied Materials 0010 47763, Oxford Instruments 800 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | 800 Plus RIEOxford Instruments |
|---|---|---|
| OEM | Applied Materials | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Oxford Instruments Plasmalab 800 |
| Specifications | ||
| Configuration | 2nd Source New[1] | may have missing parts[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Process type | — | Reactive I on Etching (RIE)[5] |
| Wafer size | — | 5 inch[4] |
| Control system | — | PC controller[5] |
| Footprint | — | All electronics and vacuum components located within tool body to minimize footprint[5] |
| RF supply | — | Advanced Energy RFX 600A[5] |
| Tur bpump | — | Leybold TMP-361C[5] |
| Tur bpump controller | — | Leybold Harris Turbotronik NT20[5] |
| Vacuum pump | — | Busch Cobra BA100[5] |
| Elecrical supply | — | 208 VAC, 3 Phase[6] |
| Included subsystems | — | Process chamber, gas-delivery and control enclosure, cooling and shutter controls, pumping/control computer[6] |
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