Waferpedia

Comparison ledger

0010 47763versus2300 Kiyo EX

Applied Materials 0010 47763, Lam Research 2300 Kiyo EX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
2300 Kiyo EXLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research 2300
Specifications
Configuration2nd Source New[1]Polysilicon[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]Polysilicon Etch[5]
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]2300 Kiyo EX[4]
OEMApplied Materials[1]Lam Research[4]
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Equipment type—Etch/Ash/Clean - Plasma Processing Equipment[5]
Currently configured for—300 mm[5]
Tool model—KIYOEX[5]
System power rating—208 AC 3-Phase[5]
Loading configuration—3 Load ports[5]
Chambers—Chamber 1, Chamber 2, Chamber 3[5]
Chamber descriptions—KIYOEX, KIYOEX, KIYOEX[5]
Process Type—Polysilicon Etch[5]
Wafer Size—300mm[5]
Load Ports—3[5]
Chamber Type—KIYOEX[5]
N2 Load Port Vendor—JUSTEM[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]macquarie.commacquarie.com