Comparison ledger
Applied Materials 0010 47763, Applied Materials Producer GT, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Producer GTApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2006– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Producer |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[3] | Missing:[1] |
| Type | Monopolar Dual Heated[4] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Model | 0010-47763[3] | Producer GT[6] |
| OEM | Applied Materials[3] | Applied Materials[6] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[4] | — |
| Quantity available (source) | 1[4] | — |
| Chamber A | — | SiCoNi[1] |
| Chamber B | — | Frontier Etch[1] |
| Wafer size | — | 12 inch[6] |
| Chamber names | — | A, B, C[2] |
| Current equipment status | — | Incoming[2] |
| Date of manufacture | — | 2009-01-01[2] |
| Configured wafer size | — | 300mm[2] |
| System power rating | — | 110 AC 3-Phase for system[2] |
| Loading configuration | — | 3 LP / 7 cooling station / 25 wafer FOUP[2] |
| Process capability | — | Advanced lithography and etch patterning down to the 22nm technology node[7] |
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