Comparison ledger
Applied Materials 0010 47763, Applied Materials DPS II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | DPS IIApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials DPS |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 2nd Source New[2] | Load port (3)[5] |
| Type | Monopolar Dual Heated[3] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[4] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Model | 0010-47763[2] | DPS II[5] |
| OEM | Applied Materials[2] | Applied Materials[5] |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[3] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[3] | — |
| Quantity available (source) | 1[3] | — |
| Category | — | Etch[1] |
| Wafer size | — | 12 inch[5] |
| Tool class | — | second-generation 300mm tool[6] |
| Process capability | — | silicon or metal etch[6] |
| Scaleability | — | scaleable for 200mm wafers[6] |
| Onboard subsystems | — | controller, endpoint, and gas panel located onboard the tool[6] |
| Footprint | — | 20 percent smaller than previous 200mm DPS models[6] |
| Demonstrated CD uniformity | — | less than 10nm across a 300mm wafer, including the edge die[6] |
| Demonstrated metal etch CD uniformity | — | less than five-percent from wafer to wafer and chamber to chamber[6] |
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