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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusCB 200 M Wafer

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, SUSS MicroTec CB 200 M Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials
CB 200 M WaferSUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedSUSS MicroTec CB 200 M Wafer
Specifications
ConfigurationRefurbished[1]—
Wafer Size—8 inch[2]
Category—Packaging & Bonding[3]
Vintage—2012[2]
Type—Wafer Bonder[2]
0010-47763 ASSY ESC Bonded Monopolar Dual Heated entryCB 200 M Wafer entryAsk about these tools →Share experience with this comparison →

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com