Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 501 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | 501 WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | EV Group 501 Wafer |
| Specifications | ||
| Configuration | Refurbished[1] | Capable of fusion compression bonding[2] |
| Wafer size | — | Manual wafer load substrate bonder[2] |
| Max Bond Force | — | 7 kN[2] |
| Top side heater | — | 550°C max. in 1°C steps[2] |
| Bottom side heater | — | 550°C max. in 1°C steps[2] |
| Temperature uniformity | — | ± 1,5 %[2] |
| Wafer sizes | — | 2, 3, 4, 5, 6 inch (up to 150 mm)[2] |
| Substrate size | — | single chips to 200 mm[3] |
| Max bond force | — | 7 kN (source 1) or up to 20 kN (source 2)[2] |
| Top side heater max temperature | — | 550°C in 1°C steps (source 1)[2] |
| Bottom side heater max temperature | — | 550°C in 1°C steps (source 1)[2] |
| Maximum temperature (source 2) | — | up to 450°C[3] |
| Vacuum (standard) | — | 1x10-1 mbar[3] |
| Vacuum (optional) | — | 1x10-5 mbar[3] |
| Power supply for anodic bonding | — | 0-2000 V, 0-50 mA[3] |
| Footprint | — | 0.8 m2[3] |
| Conversion time | — | less than 5 minutes[3] |
| Control software | — | Windows-based[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →