Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusEagle 60

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM Eagle 60, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run—2002–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM Eagle 60
Specifications
ConfigurationRefurbished[1]50/60 Hz[2]
Voltage—240 V[2]
Phase—1 Phase[2]
Frequency—50/60 Hz[2]
Minimum bond pitch—35 micron[3]
Wire type—Gold[3]
Productivity improvement—20% higher than predecessor[3]
Wire bonding type—Gold wire bonding[3]
Fine pitch capability—35 microns[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org