Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusAB 559 A 06 Wedge

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM AB 559 A 06 Wedge, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM AB 559
Specifications
ConfigurationRefurbished[1]50/60 Hz[2]
Software vs—2.42[3]
Machine type—Wedge Bonder[2]
Make—ASM[2]
Model—AB 559 A 06[2]
Frequency—50/60 Hz[2]
Voltage—240 Volts[2]
Vintage—2005[2]
Software version—2.42[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing