Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec PiXDRO LP 30 Inkjet, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | PiXDRO LP 30 InkjetSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | SUSS MicroTec PiXDRO |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | System accuracy < 5 µm (3σ)[3] |
| Temperature | — | Table temperature up to 50 °C[3] |
| System accuracy | — | < 5 µm (3σ)[3] |
| Printable area | — | 327 × 227 mm (A4)[3] |
| Max substrate thickness | — | 25 mm[3] |
| Table temperature | — | up to 50 °C[3] |
| Max motion speed | — | 250 mm/s[3] |