Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec ACS 200 Linear Wafer Tracks, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | ACS 200 Linear Wafer TracksSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2016 Reference use in 2016 |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | SUSS MicroTec ACS 200 Linear Wafer Tracks |
| Cited variants | — |
|
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | — |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Equipment type | — | Resist coater/developer[4] |
| Wafer size | — | 6 inch[4] |
| Product description | — | 200mm automated coater & developer[1] |
| Supported wafer range | — | 100 mm to 200 mm wafers[1] |
| Coating/development modes | — | Automated photoresist coating and developing[5] |
| Process capabilities | — | Spin coating and spray coating[5] |
| Hotplate baking temperature | — | Up to 250 °C[5] |
| Edge-bead removal | — | Automated edge-bead removal with backside rinse[5] |
| Supported substrate diameter | — | Maximum wafer diameter: 200 mm (8 in)[5] |
| Supported wafer diameters | — | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm[5] |
| Supported small pieces | — | Yes[5] |
| Maximum substrate thickness | — | 5 mm[5] |
| Photomask sizes supported | — | 125 mm x 125 mm; 150 mm x 150 mm[5] |