Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Panasonic NPM D 3 A Chip Mounter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | NPM D 3 A Chip MounterPanasonic |
|---|---|---|
| OEM | Applied Materials | Panasonic |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Panasonic NPM D 3 A Chip Mounter |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Model designation | — | NPM-D3A[3] |
| Product description | — | Production Modular for High-Speed, High-Precision Mounting[3] |
| PCB dimensions, dual lane mode | — | L 50 mm × W 50 mm ～ L 510 mm × W 300 mm[4] |
| PCB dimensions, single lane mode | — | L 50 mm × W 50 mm ～ L 510 mm × W 590 mm[4] |
| Placement head | — | 16 / 8 / 2[4] |
| Placement head max speed | — | 46 000 cph (0.078 s / chip); 38 000 cph (0.095 s / chip)[4] |
| Placement head placement accuracy (Cpk≧1) | — | ±37μm / chip; ±30μm / chip[4] |
| Component dimensions | — | 0402chip ～ L 100 × W 90 × T 28[4] |
| PCB transfer lane | — | Single/Dual[4] |
| Component supply | — | Taping/Stick/Tray[4] |
| Maximum number of components supply | — | 68 (Tape Width: 4 mm, 8 mm calculation)[4] |
| SKU | — | NM-EJM4D[5] |
| Model ID | — | NPM-D3A[5] |
| Model No. | — | NM-EJM6E[5] |
| PCB exchange time, dual-lane mode | — | 0 s[5] |
| PCB exchange time, single-lane mode | — | 3.6 s[5] |
| Electric source | — | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA[5] |
| Pneumatic source | — | 0.5 MPa, 100 L /min (A.N.R.)[5] |
| Dimensions | — | W 832 × D 2,652 × H 1,444 mm[5] |
| Mass | — | 1,680 kg[5] |