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0010-22161 High EFF RF MatchversusNSR SF 130

Applied Materials 0010-22161 High EFF RF Match, Nikon NSR SF 130, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsNikon
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchNikon NSR SF 130
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Exposure Wavelength—i-line (365 nm)[3]
Numerical Aperture—~0.50[3]
Max Wafer Size—200 mm[3]
Throughput—~100 wafers/hour[3]
Common Process Node—≥ 0.25 μm[3]
Release Era—Early 2000s[3]
Optical System—High-quality projection lenses optimized for i-line lithography[3]
Stage and Alignment—Precision wafer stage with interferometer-based positioning, sub-micron alignment accuracy[3]
Automation—Motorized reticle loaders, wafer handling robots, SMIF pods[3]
Control Electronics—Proprietary Nikon control software and hardware[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]junr.com.cnjunr.com.cn