Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, MPI TS 3000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | TS 3000MPI |
|---|---|---|
| OEM | Applied Materials | MPI |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | MPI TS 3000 |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[3] | — |
| Model | 0010-22161[3] | TS 3000[5] |
| Description | HTESC PH 1 REV A[4] | — |
| Condition | Used[4] | — |
| Stock Number | BM6628[4] | — |
| Manufacturer | — | MPI[5] |
| System type | — | 300 mm automated probe system[1] |
| Applications | — | DC-IV, DC-CV, Pulsed-IV, RF, mmW, load-pull, IC Design Validation, Failure Analysis[1] |
| Chuck XY stage travel range | — | 310 mm x 335 mm[1] |
| Chuck XY stage resolution | — | 0.5 µm[1] |
| Chuck Z stage travel range | — | 30 mm[1] |
| Chuck Z stage resolution | — | 0.2 µm[1] |
| Wafer loading | — | 150 mm, 200 mm, or 300 mm wafers or substrates[1] |
| Probe card holder | — | 4.5 x 11 in[1] |
| Max. no. of micropositioners | — | 10x DC MicroPositioners or 4x DC + 4x HF MicroPositioner[1] |
| Temperature range | — | 20 °C to 300 °C[1] |
| Temperature range with IceFreeEnvironment | — | -60 °C to 300 °C[1] |
| Control software | — | SENTIO[1] |
| Chuck top material | — | Nickel plated aluminum[1] |
| Chuck surface | — | Planar with 0.5 mm diameter holes in centric sections[1] |
| Supported DUT sizes | — | Single DUTs down to 5x5 mm size or wafers 100 mm thru 300 mm[2] |
| Maximum voltage between chuck top and GND | — | 500 V DC[1] |