Waferpedia

Comparison ledger

0010-22161 High EFF RF MatchversusGasonics L 3510 Asher / Stripper

Applied Materials 0010-22161 High EFF RF Match, Lam Research Gasonics L 3510 Asher / Stripper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsLam Research
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchLam Research Gasonics L 3510 Asher / Stripper
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Microwave Power—0–1200 W at 2.45 GHz[3]
Pressure Range—0.5 to >5.0 torr[3]
Platen Temperature—100–300°C[3]
Ash Rate—Up to 3.5 µm/min[3]
Throughput—45–60 WPH[3]
Within Wafer Uniformity—±5% to 10%[3]
Wafer-to-Wafer Uniformity—±5% to 10%[3]
Process Gas—O2, N2[3]
Wafer Size Support—75 mm to 200 mm (3 to 8 inch)[4]
Process Type—Downstream microwave plasma ashing[4]
Endpint Detection—Yes, typical[4]
Heating—Platen and lampe heating[3]
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]allwin21.comallwin21.com
  4. [4]semistarcorp.comsemistarcorp.com