Comparison ledger
Applied Materials 0010-21246 Part, Besi 2200 EVO Tool Holder, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-21246 PartApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Besi 2200 EVO Tool Holder |
| Cited variants | — | |
| Specifications | ||
| Make | — | Besi / Datacon[2] |
| Model | — | 2200 EVO Tool Holder[2] |
| Asset Number | — | 83809[2] |
| X/Y Placement Accuracy | — | ±10 µm @ 3σ[3] |
| Theta Placement Accuracy | — | ±0.15° @ 3σ[3] |
| Bond Force Range | — | 0.5N to 75N programmable[3] |
| UPH Die Attach | — | up to 7,000 UPH/module[3] |
| UPH Flip Chip with dipping | — | up to 2,500 UPH/module[3] |
| UPH Flip Chip without dipping | — | up to 3,200 UPH/module[3] |
| Machine Dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[3] |
| Machine Weight | — | 1,300 kg[3] |
| Uptime | — | > 98%[3] |
| Yield | — | > 99.95%[3] |
| Die Size (Die Attach) | — | 0.17 mm - 50 mm[3] |
| Die Size (Flip Chip) | — | 0.5 mm - 50 mm[3] |
| Die Thickness | — | >50 µm (thinner on request)[3] |
| Wafer Size | — | 4" - 12" (SEMI M1)[3] |
| Frame Size | — | FF070, FF105, FF108, FF123; automatic change (others on request)[3] |
| Substrate Working Range | — | 13" x 8" (325 mm x 200 mm)[3] |
| Bond Head Rotation | — | 0° to 360°[3] |
| Heated Bond Head (optional) | — | up to 450°C[3] |
| UV Curing Wavelengths | — | 365 nm and 405 nm[3] |
| Product type | — | Tool holder[2] |
| Wafer handling | — | 12" wafer handling[3] |
| Integrated dispenser | — | Included[3] |
| Automatic tool changer | — | Included[3] |
| Vintage | — | 2010[4] |