Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusUnity II E 855 DD Dry

Applied Materials 0010-16392 ESC Assembly, Tokyo Electron Unity II E 855 DD Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Unity II E 855 DD DryTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTokyo Electron Unity II E 855
Specifications
OEMApplied Materials[1]Tel[3]
Model0010-16392[1]Unity II E 855 DD[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—Needs RFQ[3]
Equipment type—Dry Etcher[3]
Wafer size—8 inch[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing