Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusTE 8501 Wet Oxcide

Applied Materials 0010-16392 ESC Assembly, Tokyo Electron TE 8501 Wet Oxcide, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
TE 8501 Wet OxcideTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC Assembly—
Specifications
OEMApplied Materials[1]Tokyo Electron[3]
Model0010-16392[1]TE 8501[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Tool type—Wet Oxcide Etcher[3]
Vintage—1996[3]
Category—Etch[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com