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Comparison ledger

0010-16392 ESC AssemblyversusMACS ICP

Applied Materials 0010-16392 ESC Assembly, SPTS MACS ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
OEMApplied MaterialsSPTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblySPTS MACS ICP
Cited variants—
Specifications
OEMApplied Materials[2]—
Model0010-16392[2]MACS ICP[4]
TypeESC Assembly[2]—
Wafer Size300 mm[3]—
Electrode ConfigurationDual[3]—
Configuration—HR chamber[4]
Clamp type—standard WTC[4]
Coil RF power—Advanced Energy RFG3001, 3kw[4]
Platen RF power—ENI ACG-3B 13.56MHZ, 300w[4]
Load lock pump—Ebara AAL10[4]
Chamber pump—Ebara A30W[4]
Turbo pump—Leybold MAG2000CT[4]
Turbo Pump Controller—Leybold MAG Drive 2000[4]
Chiller—ATS/DEX-20ADI[4]
Manufacturer—SPTS / STS[4]
Category—Etch[5]
Wafer size—8 inch[4]
Chamber—HR chamber[4]
Wafer capability—6", 8" capable[4]
Wafer handling—MACS loader for cassette to cassette operation (2 load stations)[4]
Vacuum load lock—Carousel vacuum load lock[4]
Backside cooling—Helium backside cooling (HBC)[4]
Gases—C4F8 (200 sccm); SF6 (1000 sccm); O2 (200 sccm); Ar (50 sccm)[4]
Vintage—2002[4]
Voltage—208 Volts / 60 Hz, 40 Amps/phase[1]
Chamber quantity—1 chamber[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]hommer.com.twhommer.com.tw
  2. [2]Equipment inventory listing
  3. [3]spwindustrial.comspwindustrial.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]challentech.com.twchallentech.com.tw