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Comparison ledger

0010-16392 ESC AssemblyversusExelan Dry

Applied Materials 0010-16392 ESC Assembly, Lam Research Exelan Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Exelan DryLam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyLam Research Exelan Dry
Cited variants—
Specifications
OEMApplied Materials[4]—
Model0010-16392[4]Exelan Dry[6]
TypeESC Assembly[4]—
Wafer Size300 mm[5]300mm[1]
Electrode ConfigurationDual[5]—
Vintage (manufacturing year)—2005[1]
Wafer Size (via version)—200mm[3]
Vintage—2004-06-01[2]
Manufacturer—Lam Research[6]
Tool type—dry etch chamber[7]
Vintage year—2005[7]
Variant designation—V2 Exelan[7]
Variant wafer size—200mm[7]
Variant vintage year—2004[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]csisemi.comcsisemi.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]Equipment inventory listing
  5. [5]spwindustrial.comspwindustrial.com
  6. [6]Equipment inventory listing
  7. [7]waferpedia.comwaferpedia.com