Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusP 5000 Mark II Dielectric

Applied Materials 0010-16392 ESC Assembly, Applied Materials P 5000 Mark II Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
P 5000 Mark II DielectricApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyApplied Materials P 5000 Mark II
Specifications
OEMApplied Materials[1]Applied Materials[3]
Model0010-16392[1]P 5000 Mark II[3]
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—
Configuration—MxP+[3]
Tool type—Dielectric Etch[3]
Wafer size—6 inch[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]inventory listing
  4. [4]inventory listing