Comparison ledger
Applied Materials 0010-13622 RF Match for, Tokyo Electron Telindy Plus I M 1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Telindy Plus I M 1Tokyo Electron |
|---|---|---|
| OEM | Applied Materials | Tokyo Electron |
| Category | Deposition | Deposition |
| Wafer size | — | 125 Wafer Load Size |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Tokyo Electron Telindy |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Dual Boat System Option[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Wafer size | — | 125 Wafer Load Size[2] |
| Power | — | 400 VAC[2] |
| Phase | — | 3 Phase[2] |
| Wafer Load Size | — | 125 wafers[2] |
| Dual Boat System Option | — | Yes[2] |
| Vintage | — | 2020[2] |
| Process Type | — | Atomic Layer Deposition (ALD)[2] |
Plan your fab
Building a Deposition process? Get a complete equipment list.
Open the fab equipment planner →