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Comparison ledger

0010-13622 RF Match forversusMVD300

Applied Materials 0010-13622 RF Match for, SPTS MVD300, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
MVD300SPTS
OEMApplied MaterialsSPTS
CategoryDepositionDeposition
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forSPTS MVD300
Cited variants—
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[2]—
Model0010-13622[2]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[2]—
FeatureHigh Efficiency HE RF Match-Bias[2]—
System type—Molecular Vapor Deposition (MVD) system[1]
Configured models—MVD300 / MVD300E[1]
Target manufacturing use—High volume manufacturing applications[1]
Processing mode—Batch processing[1]
Wafer handling—200mm wafers (Pod loader or EFEM available); 300mm wafers (EFEM enabled)[1]
Other substrate formats—Singulated die on tape frames; components on trays; custom substrate fixturing available[1]
Precursors—Up to 4 precursors[1]
Integrated functions—Integrated plasma surface treatment and chamber clean capability[1]
Automation—Automated process sequence routines[1]
Diagnostics—Extensive self-diagnostic and data logging capability[1]
Reliability—Exceptional reliability[1]
Process compatibility—MVD and ALD-capable[1]
Wafer size—200mm (Pod loader or EFEM) / 300mm (EFEM)[1]
Number of precursors—Up to 4[1]
Plasma treatment—Integrated plasma surface treatment and chamber clean capability[1]
Substrate types—Wafers, singulated die on tape frames, components on trays, custom fixturing[1]
ALD capability—MVD and ALD-capable[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing