Comparison ledger
Applied Materials 0010-13622 RF Match for, Perkin Elmer 4400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 4400Perkin Elmer |
|---|---|---|
| OEM | Applied Materials | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Perkin Elmer 44xx |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Pump Exhaust GEEX[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Handler Type | — | Manual[2] |
| CDA | — | 60-80 psi[2] |
| Chilled Water | — | 68 F, 2 gpm[2] |
| N2 | — | 50 psi[2] |
| HPN2 | — | 60 psi[2] |
| HPAr | — | 10 psi[2] |
| O2 | — | 10 psi[2] |
| Power | — | 208 V, 3 Phase, 60 A[2] |
| Process Type | — | Sputtering / Physical Vapor Deposition[4] |
| Wafer Size | — | 6 inch[5] |
| Sputtering Types | — | DC, RF, DC-RF bias capable[3] |
| Target Positions | — | Ports for four targets; three utilized (two DC with RF bias, one RF)[3] |
| Load Lock | — | Yes[3] |
| RF Etch Option | — | Yes[3] |
| Pump - Main Chamber | — | Cryotorr 8 cryopump with CTI SC (air-cooled) He compressor[3] |
| Pump - Load Lock | — | Pfeiffer turbopump backed by Trivac rotary vane pump[3] |
| Roughing Pump | — | Ebara A10 roots pump[3] |
| Power Supply | — | Present[2] |
| AC Distribution Box | — | Present[2] |
| Heat Exchanger / Chiller | — | Present[2] |
| Backing Pump | — | Present[2] |
| Cryo Compressor | — | Present[2] |
| Mechanical Pump | — | Present[2] |
| CDA Supply | — | 60-80 psi[2] |
| Chilled Water Supply | — | 68 F, 2 gpm[2] |
| N2 Supply | — | 50 psi[2] |
| HPN2 Supply | — | 60 psi[2] |
| HPAr Supply | — | 10 psi[2] |
| O2 Supply | — | 10 psi[2] |
| Power Requirement | — | 208 V, 3 Phase, 60 A[2] |
| Pump Exhaust | — | GEEX[2] |
| GEM / SECS | — | Present[2] |
| Cables | — | All cables present[2] |
| Standard Manual | — | Included[2] |
| CE Mark | — | No[2] |
| Vintage | — | 2004[2] |
| Equipment type | — | Sputtering system[4] |
| Target ports | — | Four target ports[3] |
| Process modes | — | DC and RF, with DC-RF bias capable[3] |
| Options | — | RF etch option[3] |
| Load lock | — | Load lock[3] |
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