Comparison ledger
Applied Materials 0010-13622 RF Match for, Denton Vacuum Desktop Pro, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Desktop ProDenton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Denton Vacuum Desktop Pro |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | 50/60 Hz[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Voltage | — | 208 VAC[2] |
| Process type | — | Magnetron sputtering[3] |
| Deposition mode | — | DC & RF sputtering[3] |
| Substrate size | — | 4-inch diameter[3] |
| Footprint | — | Less than 36 inches (914 mm) of desk space[3] |
| Vacuum capability | — | High vacuum, 10^-6 torr range[3] |
| Pump-down time | — | Less than 30 minutes[3] |
| Cathodes | — | Up to two 2.0-inch diameter magnetrons[4] |
| Substrate stage | — | Rotating substrate stage[3] |
| Applications | — | Sputtering, materials research, product QC & QA, semiconductor failure analysis, nanotechnology, compound semiconductors[3] |
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