Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Endura 5500 Metal Sputterer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Endura 5500 Metal SputtererApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Endura 5500 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | W × 2ch、Wsi × 1ch[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Wafer Sizes | — | 6 inch[2] |
| Wafer Size | — | 200mm[3] |
| Type | — | metal sputterer[4] |
| Category | — | Deposition[4] |
| Process description | — | PVD system for semiconductor thin film deposition[5] |
| Options | — | No PreClean or PreHeat[2] |
| Option | — | DP is included[2] |
| Chamber specification | — | A - Pass Thru, B - Cooldown, C - PreClean PIK II, E,F - Orienter/Degas, 1 - Widebody AlCu, 2 - Watercool MCA+, 3 - Widebody TiN, 4 - Watercool MCA+[3] |
| Robot | — | HP(buffer and Transfer)[3] |
| Loadlock | — | Narrow Body[3] |
| Vacuum pressure | — | 5e-9 Torr[5] |
| Number of chambers | — | 4 to 6[5] |
| Power requirements | — | 208 volts[5] |
| Gas type | — | argon nitrogen[5] |
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