Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Endura 5500 IMP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Endura 5500 IMPApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Endura 5500 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | No SMIF Interface2 x OD[2] |
| Model | 0010-13622[1] | Endura 5500 IMP[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Software Version | — | B8.01[2] |
| Wafer Type | — | Notch[2] |
| Line Frequency | — | 50 Hz[2] |
| Line Voltage | — | 200-208 V[2] |
| Line Amperage | — | 320 A[2] |
| Make | — | Applied Materials[2] |
| Category | — | Deposition[3] |
| Wafer Sizes | — | 8 inch[2] |
| PVD type | — | Physical Vapor Deposition[2] |
| No SMIF Interface | — | 2 x OD[2] |
| Vacuum | — | CTI 9600 Cryo compressor (2)[3] |
| Chamber A | — | Pre-Clean Chambers[2] |
| Chamber B | — | Cool Down Chamber[2] |
| Chamber C | — | Chamber C[2] |
| Chamber D | — | Chamber D[2] |
| Chamber E | — | Degas/Orienter Chamber[2] |
| Chamber F | — | Degas/Orienter Chamber[2] |
| Chamber 1 | — | Chamber Process: PC II[2] |
| Chamber 2 | — | Chamber Process: IMPTiN; Rough Pump Not Included[2] |
| Chamber 3 | — | Chamber Process: IMPTiN; Rough Pump Not Included[2] |
| Buffer Chamber | — | Robot: HP 2000 Vintage[2] |
| Chamber 1 process | — | IMPTiN[2] |
| Chamber 2 process | — | IMPTiN[2] |
| Chamber 3 process | — | IMPTiN[2] |
| Loadlock Type | — | Wide Body L/L[2] |
| Chamber Process | — | PC II[2] |
| Robot | — | HP[2] |
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