Waferpedia

Comparison ledger

0010-13622 RF Match forversusEndura 5500

Applied Materials 0010-13622 RF Match for, Applied Materials Endura 5500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Endura 5500Applied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run—1990–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Endura 5500
Cited variants—
  • Liner/Barrier[1]
  • Front-End Metallization[2]
  • Aluminum Interconnect[3]
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[4]Main AC Power Intel Hole[5]
Model0010-13622[4]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[4]—
FeatureHigh Efficiency HE RF Match-Bias[4]—
Line Frequency—50 Hz[5]
Wafer Shape—SNNF[5]
Position 1—Dura TTN[5]
Position 1 Process—Durasource TTN[5]
Position 2—Aluminum[5]
Position 2 Process—Durasource AL[5]
Position 3—Dura TTN[5]
Position 3 Process—Durasource TTN[5]
Position 4—Aluminum[5]
Position 4 Process—Durasource AL[5]
Position A—Pass Thru[5]
Software—v8.89[10]
Robot—HP with Fabworx Blade, Wrist, and Arms[10]
Ch1/ch3—AICu[10]
Pedestal—A101[10]
ChE/ChF—Orient Degas[10]
Ch1—Ti[11]
Ch3—AICu[11]
Ch2/Ch4—TiN[11]
ChC/ChD—RF PCII[11]
Ch2/Ch3—AICuW[12]
Ch4—TiN[12]
ChC—RF PCII[12]
ChE—Orient Degas[12]
Ch2—AICuW[13]
Voltage—430 VAC[16]
Phase—3 Phase[18]
Frequency—60 Hz[19]
4 PVD Chambers—2TiN/1Ti/1Al[20]
2 CVD / 3 PVD Chambers—2TxZ/1Ti/1IMP Ti/1Co[1]
5 PVD Chambers—2TiN/1Ti/1Al/1NiPt[22]
Wafer Size—8 inch (200 mm)[5]
Electrical Configuration—3 Phase, 3 Wire + Ground, 480 Vac[22]
Chamber Configuration (example 1)—5 PVD Chambers: 2 TiN, 1 Ti, 1 Al, 1 NiPt[22]
Chamber Configuration (example 2)—2 CVD / 3 PVD Chambers: 2 TxZ, 1 Ti, 1 IMP Ti, 1 Co[1]
Transfer Chamber Positions (example)—Position 1: Durasource TTN, Position 2: Durasource AL, Position 3: Durasource TTN, Position 4: Durasource AL[5]
Buffer Chamber Positions (example)—Position A: Pass Thru, Position B: Cooldown, Position C: Durasource TI, Position F: Orienter (Standard Degas)[5]
System Safety Features—EMO (Turn to Release), GFI on Primary with EMO Shunt Trip, GFI on Secondary, Circuit Breaker 400 A, GFI Trip 50-100 mA, Water Leak Detector, Smoke Detector[5]
Position B—Cooldown[5]
Position C—Titanium[5]
Position C Process—Durasource TI[5]
Position F—Orienter[5]
Position F orient Type—Standard Degas with Temp feedback (Gimball Type)[5]
System EMO Type—Turn to Release[5]
Primary Side Trip Amperage—3 P 3 L 208 VAC[5]
Circuit Breaker on Secondary—400 A[5]
GFI Trip Amperage—50 ~ 100 mA[5]
Wafer Sizes—8 inch[5]
Vintage—2000[22]
Chamber Configuration (Transfer Chamber)—Position 1: Dura TTN, Position 2: Aluminum, Position 3: Dura TTN, Position 4: Aluminum[5]
Buffer Chamber Positions—Pass Thru, Cooldown, Titanium, Orienter (Standard Degas with Temp feedback)[5]
Chamber Configuration—2 CVD / 3 PVD Chambers: 2TxZ/1Ti/1IMP Ti/1Co[1]
Robot Type—VHP[3]
Application—Liner/Barrier[1]
Electrical—3 Phase - 3 Wire + Ground - 60 Hz - 480 Vac[22]
PVD Chamber Count—5[3]
PVD Chamber Types—2TiN/1Ti/1Al/1NiPt[3]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (22)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]inventory listing
  9. [9]inventory listing
  10. [10]inventory listing
  11. [11]inventory listing
  12. [12]inventory listing
  13. [13]inventory listing
  14. [14]inventory listing
  15. [15]inventory listing
  16. [16]inventory listing
  17. [17]inventory listing
  18. [18]inventory listing
  19. [19]inventory listing
  20. [20]inventory listing
  21. [21]inventory listing
  22. [22]inventory listing