Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Centura Ultima TE HDP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Centura Ultima TE HDPApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | (1) Wafer Orienter Chamber |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Centura Ultima TE HDP |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | Centura Ultima TE HDP[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Voltage | — | 208 Vac[2] |
| Phase | — | 3 Phase[2] |
| Frequency | — | 60 Hz[2] |
| Wafer size | — | (1) Wafer Orienter Chamber[2] |
| Manufacturer | — | Applied Materials[2] |
| Process | — | HDP CVD (Chemical Vapor Deposition)[2] |
| Chamber configuration | — | 1 Ultima TE Chamber, 2 DxZ Nitride Chambers, 1 Wafer Orienter Chamber, 1 Multi-Slot Cooldown Chamber[2] |
| Electrical requirements | — | 208 Vac, 3 Phase, 4 Wires, 60 Hz[2] |
| Vintage | — | 2004[2] |
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