Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Centura 5200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Centura 5200Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Centura 5200 |
| Cited variants | — | |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[3] | Mainframe[4] |
| Model | 0010-13622[3] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[3] | — |
| Feature | High Efficiency HE RF Match-Bias[3] | — |
| Gas boxes | — | 2 populated out of 4 available[4] |
| Process chamber | — | 5200 WxZ CVD[4] |
| Light Tower | — | Four Color Tower[1] |
| Loadlock Type | — | Narrow Body - Auto Tiltout[1] |
| Buffer Robot | — | Single Blade HP+[1] |
| Gas Panel Type | — | Seriplex[1] |
| Chamber Process Type | — | WxZ[1] |
| Chamber Clean Process | — | RF Plasma[1] |
| Backside Pressure Control | — | MKS 1170 Argon 2SLM[1] |
| Lid Assembly | — | Enhanced Cooled Lid[1] |
| Heater Type | — | AL W/Ceramic Purge Ring[1] |
| Wafer size (PECVD configuration) | — | 8 inch[1] |
| Buffer chamber pump | — | Ebara A 10 W[1] |
| Backing pump (Chamber A & B) | — | Ebara A 70 W WXZ[1] |
| Loadlocks backing pump | — | Ebara A 10 W[1] |
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