Comparison ledger
Applied Materials 0010-03485 Magnet Assy, ESPEC TSE 11 A Thermal Shock Experimental, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | ESPEC |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | ESPEC TSE 11 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | 50/60 Hz[5] |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | TSE 11 A[5] |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | ESPEC[5] |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Voltage | — | 200 V[5] |
| Phase | — | 3 Phase[5] |
| Equipment type | — | Thermal shock experimental machine[5] |
| Electrical rating | — | 200 V, 3 phase, 50/60 Hz[5] |
| High temperature exposure range | — | +60 to +200°C[6] |
| Low temperature exposure range | — | -65 to 0°C[6] |
| Temperature fluctuation | — | ±0.5°C[6] |
| Pre-heat upper limit | — | +200°C[6] |
| Pre-cool lower limit | — | -80°C[6] |
| Temp. heat-up time | — | Ambient temp. to +200°C within 30 min.[6] |
| Operating power | — | 208 V, 3Ph, 50/60 Hz, 26A[7] |
| Temperature range | — | -60°C to 200°C[8] |
| Test baskets | — | Two product test baskets measuring 12” long x 9” wide x 1” high[8] |
| Inside dimensions | — | 12.5” L x 9” W x 6” H[7] |
| Exterior dimensions | — | 26” L x 42” W x 64” H[7] |
| Control interface | — | Full featured touch screen programmer[7] |
| Cooling | — | Mechanical refrigeration[7] |
| Condenser | — | Air cooled condenser[8] |
| Design | — | Compact design[6] |
| Transfer method | — | 2-zone transition by vertical transfer of specimen[6] |